|
Please register for any of the below tutorials at the conference registration
site. Please go to:
https://icm3.ieee.org/eventmanager/onlineregistration.asp?eventcode=kg4
9:00am-1:00pm:
"Application of
Radiolocation in Wireless Networking" - presented by Danko Antolovic,
Indiana University
The tutorial
will review the principles of radiolocation and analyze several
radiolocation methods. Participants will gain familiarity with both
physical principles and design issues underlying localization in
wireless networking. This knowledge is directly applicable in the
development of smart and adaptive wireless devices. Topics
include: The need for radiolocation in wireless networking; an
overview of different radiolocation methods; time-of-flight methods;
phased arrays; dense-coverage and trainable networks; exposition of
Indiana University Radiolocator (the Porcupine); multi-antenna image
synthesis; real-time radiolocation; and, integrated radiolocation
and networking, adaptive response.
9:00am-1:00pm:
"Liquid Crystal Displays in Portable Information Devices" -
presented by Claire Gu, University of California at Santa Cruz
As we step
into the information age, displays have become an integral part of
our daily life. They are everywhere, from watches, calculators,
cameras, cellular telephones, televisions, computer monitors, to
panels of global positioning systems (GPS), oscilloscopes, medical
equipment, pilot displays, etc. In the computer world, a display is
essential for us (human beings) to interact with all the digital
electronics. The advantages of LCDs have given them the
dominating position in the display market. Compared with CRTs, they
are lighter, thinner, flicker and radiation free, energy efficient,
and portable. Compared with other flat panel displays (FPDs) such as
Plasma Display Panels, Electroluminescent Displays, Field Emission
Displays, LED (light emitting diode) Displays, LCDs are more mature,
therefore, provides higher performance, longer lifetime, and lower
cost. Liquid crystal displays have become the dominating technology
in flat panel displays in recent years, even though they are not
perfect. In the world of mobile products, such as cell phones, PDAs,
handheld games, MP3 players, digital cameras, and navigation
systems, it is essential to have a display with small size, light
weight, and most importantly high energy efficiency.
This
tutorial will provide an overview of the principle of
operation and applications of various types of LCDs
and introduce some recent developments in LCD technologies aimed at
higher quality and lower power consumption. Specifically, the
following topics will be discussed: basic components of LCD,
optical wave propagation in anisotropic media, modeling of
LCDs, various LCD modes, LCD backlights, electronic control of LCDs,
and applications of LCDs in PIDs.
9:00am-1:00pm:
“Predictive modeling of Photonic and Microelectronics Materials
Reliability” – presented by D. Ingman, Industrial Engineering and
Management at Technion – Israel Institute of Technology
The lecture
deals with the modern techniques and approaches to predict the
reliability of high tech photonic and micro-electronic materials.
Physical Acceleration ( "True" Acceleration) has to do with
operating a unit (an object) at a high stress (i.e., temperature, or
voltage, or humidity, or duty cycle, etc., higher than what the unit
encounters in actual operation) and produce the same modes and
mechanisms of failure (s) that would occur at typical-use stresses,
except that the failures happen much faster. Acceleration factors
show how time-to-failure at a particular operating stress level (for
the given failure modeor mechanism) can be used to predict the
equivalent time to fail at a different operating stress level.
9:00am-1:00pm:
“Aging and Fracture of Polymers” - A. Chudnovsky, Univ. of Illinois
at Chicago, IL, USA
The
following topics will be covered in this session.
- Brief
history of concepts of materials strength and toughness.
-
Fracture mechanism maps. Role of defects; generalized forces
acting on defects.
-
Structure-properties relations; polymers aging, creep and
fatigue of polymers.
- Modes
of failure: ductile, brittle and stress corrosion cracking (SCC).
Stress – time to failure relations.
-
Accelerated testing: existing standards, challenges of
“acceleration” of failure.
-
Fundamental mechanism of ductile failure: ductile failure as a
delayed necking.
-
Understanding of brittle fracture: formation of process zone in
front of a propagating crack.
- Role of
chemical degradation in fracture of polymers under low stress (SCC).
2:00pm
-6:00pm:
" Polymers and nano-Composites
for Electronic and Photonic Packaging
: Recent Advances on Materials and Process" - presented by CP
Wong, Georgia Institute of Technology
Polymers are
widely used in electronic packaging as adhesives, encapsulants,
insulators, dielectrics, molding compounds and conducting elements
for interconnects. These materials also play a critical role in the
recent advances of low-cost, high performance Novel No Flow
Underfills, Reworkable Underfills for Ball Grid Array (BGA), Chip
Scale Packaging (CSP) , System on a Package(SOP)), Direct Chip
Attach(DCA), Flip-Chip(FC) , Paper- thin IC and 3D Packaging,
Conductive Adhesives( both ICA and ACA), Embedded Passives( high K
polymer composites), nano particles and nano-functional materials.
It is imperative that both material suppliers, formulators and their
users have a thorough understanding of polymeric materials and the
recent advances on nano materials and their importance in the
advances of the electronic packaging and interconnect technologies.
2:00pm -6:00pm:
"Embedded Actives and Passives in PCB, LCP and Paper Substrates" -
presented by Swapan Bhattacharya, Georgia Institute of Technology
Taking a
system level top down approach, this course will discuss the
advantages and limitations of ceramic vs. organic passives in
system-on-chip, system-in-chip, and system-on-package platforms.
Various approaches to embedding passives in the substrate/package
will be reviewed and the potential impact of embedded passives in
the future electronic products will be presented in light of
increased functionality and performance with reduced size and cost.
Electrical design and modeling, heterogeneous integration, test
methodologies for embedded passives will be addressed. The concept
of embedded actives will be discussed with examples from various
embedded active consortiums. Applications of flexible and low loss
liquid crystal polymers (LCP) will be discussed in the range 2-110
GHz. Implementation of embedded passives and RFIDs in multi-layer
paper substrates by ink jet printing and conventional copper
metallization will be presented.
2:00pm -6:00pm:
“Basics of Thermal Management, with
Application to Portable Electronics” – presented by J.
Nicolics, Department of Applied Electronics Materials, Institute of
Sensor and Actuator Systems, Vienna University of Technology,
Austria
Among
numerous fields of commercial electronics for portable electronics
the highest degree of miniaturization and the lowest possible weight
are mandatory design targets. These principle boundary conditions in
combination with high clock frequency and wireless interfaces often
leads to high power loss concentration. As a consequence critical
temperature levels can be reached locally causing failures and
enhanced aging. An optimized thermal design allows to achieve high
reliability at competitive cost. The goal of the course is to
provide a deeper understanding of heat generation, heat transfer,
thermal failure mechanisms, design possibilities to control peak
temperature, cooling methods particularly for portables,
steady-state and dynamic thermal characterization of components and
assemblies using both, experimental procedures and thermal modeling,
and the meaning of the generated temperature distribution inside of
an assembly for thermomechanical issues. Practical examples and
real-case studies of thermal problems and solutions are discussed
(e.g. HDI multilayer PCBs with embedded resistors, pulse load
resistivity of GaAs-devices etc). Favorable solutions for portable
electronics like heat pipes, thermal vias, and thermal interface
materials (TIM) are demonstrated.
2:00pm
-6:00pm:
“Dynamic
Response of Electronic and Photonic Systems to Shocks and
Vibrations, and Shock Protection of Portable Electronics” -
presented by E.
Suhir, University of California at Santa Cruz
In
commercial electronics, dynamic loading can take place during
handling or transportation of the equipment. In military, avionics,
space, automotive, and marine electronics, dynamic loading, whether
deterministic or random, is expected to occur even during normal
operation of the system. Random vibrations are often applied
deliberately (in addition to, or even instead of, thermal cycling or
mechanical testing) as an effective and fast means to detect and
weed out infant moralities in the system. Development of new shock
absorbing “smart” materials and “smart” structures is equally
important, as well as the ability to evaluate (predict, model ) and
possibly optimize the dynamic response of various components and
devices to shocks and vibrations . The necessity to protect
portable electronics from shock loading (typically, because of an
accidental drop) resulted in an elevated interest in the development
of both theoretical methods and experimental techniques for the
prediction of the consequences of an accidental shock, as well as
for an adequate shock protection of portable products.
|
